With the rapid development of mobile processor technology, more and more quad-core or eight-core processor has been entered the user's field of vision, and also because many of these SoC core and high frequency causes the temperature to rise sharply. As the world's thinnest phone OPPO R5, how to solve this problem? We take a look at:
Mobile phones work in high temperature environment for a long time, either caused by crashes, restart phone, stability, and can speed up aging of mobile phone components. In addition, for high-frequency for the CPU and GPU now, high temperatures cause block problem, will make the phone performance drastically. Marcelo Burlon iPhone 6+
General phone solution is where thermal conductivity is required where a layer of graphite, improving the thermal efficiency of parts surface, K>100 of graphite thermal conductivity, excellent thermal conductivity, but due to the air insulation, heat from the chip to the graphite on the efficiency of higher calorific value than low heat makes the phone is more concentrated, not quickly dissipated.
Can see the cell phone on the comparison of the heat concentrated in the SoC.
OPPO R5 has the world's thinnest 4.85mm body, and carrying 8 core 64-bit SoC, it is how to solve the problems inside the heat sink it?
Since introduction of the OPPO's official view, ice core is cooling the nest using a type of liquid metal thermal interface material (thermal conductivity K=3.3), fill the chip between the graphite and air (thermal conductivity K=0.023) so that the heat is passed quickly to the phone's skeleton and graphite disperse heat evenly on the skeleton.
Comparison between three kinds of heat.
R5 IC focuses on one side of the Board.
In addition, due to the heat transfer medium is a liquid metal material, if direct contact and SoC IC, will short circuit problem, R5 of single sheets are also used to solve this problem, placing SoC chip on the motherboard, and the other side is labeled liquid metal thermal conductivity of the material. When the phone after the temperature, type of liquid metal into liquid, fill the motherboard and the spaces directly in the box, so as to enhance the cooling speed.
R5 motherboard disassembly diagram, we can see that the whole motherboard design is relatively compact.
R5 dismantling, motherboard, battery, and the thickness of the Super AMOLED screen is very low.
R5 wasn't as concentrated as the General phone, maximum temperature is well controlled.
Such liquid metals-related properties:
Working temperature: 27 ° c 45 ° c complete the phase transition from solid to a liquid
Lifespan: 3 years
Mobility tests: under 70 ° c, test for 96 hours, flow or overflow does not occur, and so on.
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